Senior Package Layout Engineer - Hardware

Details

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions!

Responsibilities

• Collaborate with Technical Package Lead and different design teams in the design and development of complex, detailed layout of IC substrates for NVIDIA products.
• As part of a Layout team, implement high speed/density ASIC packages.
• Perform substrate breakout patterns for ASIC packages.
• Optimize package pinout incorporating system level trade-offs of pins assignment.
• Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
• Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
• Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
• Develop symbols and CAD library databases using Cadence APD design tools.
• Develop methodologies to improve layout productivity.

Requirements

• Hold a B.S. Electrical Engineering or equivalent experience.
• 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus.
• Proven experience in substrate layout of wire bond and flip chip packages is preferred.
• Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager).
• Validated working knowledge of high-speed design signal integrity practices.
• Experience using Valor is helpful.

Benefits

• Base salary range is 128,000 USD - 247,250 USD.
• Eligible for equity and benefits.