Package Design Methodology Engineer

Details

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing.

NVIDIA's Advanced Package Engineering team sits at the intersection of cutting-edge chip design and the physical reality of getting silicon to product—and we're expanding it. As AI systems grow more complex, NVIDIA's multi-die packages have become some of the most challenging engineered products, connecting dozens of chiplets across substrates, interposers, and heterogeneous interfaces.

As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work.

What you'll be doing

• Work with world-class engineers to design and implement VLSI tools for silicon and substrate design.
• Develop applications to enable project engineers with an emphasis on maintainability and ease of use.
• Develop flows/tools and methodologies to construct, analyze, and validate package designs at many different stages in the production flow.
• Optimize the daily workflows of the world's top package designers.

Requirements

• BS in Computer Science, Electrical Engineering, or a related field (or equivalent experience), and 5+ years of flow and methodology development experience building flows for package design used by engineering teams at scale.
• Good programming fundamentals in Python and/or C++, including proficiency with data structures, algorithms, object-oriented design, and code quality practices.
• Demonstrated experience applying AI/ML techniques in engineering workflows—this could include using LLMs for code generation and debugging, building ML-assisted design analysis tools, or integrating AI-assisted flows into EDA environments.
• Strong understanding of electrical engineering fundamentals relevant to VLSI package design (signal integrity, power delivery, parasitic extraction, or equivalent).

Ways to stand out from the crowd

• Good understanding of VLSI package design along with interposer and IC physical design.
• Strong expertise in developing package design flows and methodologies.

Additional information

• Your base salary will be determined based on your location, experience, and the pay of employees in similar positions.
• The base salary range is 136,000 USD - 218,500 USD for Level 3, and 168,000 USD - 264,500 USD for Level 4.
• You will also be eligible for equity and benefits.
• Applications for this job will be accepted at least until July 31, 2026.
• This posting is for an existing vacancy.